Latest Technologies
Records 624
2021-09-22, RISCIC completes tens of millions of dollars in A+ round of financing, and RISC-V chips are about to enter the high-end
mpletes tens of millions of dollars in A+ round of financing, and RISC-V chips are about to enter the high-end Recently, RISC-V company RISCIC completed tens of millions of dollars in A+ round of financing.
2021-09-21, TSMC enters a new round of price increases, Samsung chip foundry services increase prices by 20%
rs a new round of price increases, Samsung chip foundry services increase prices by 20% Due to the strong global demand for integrated circuit chips, from last fall to this spring, foundries such as TSMC, GlobalFoundries, PSMC, SMIC and UMC have raised their prices by more than 10%.
2021-09-21, How far has advanced packaging progressed?
as advanced packaging progressed? In the market for advanced packaging, OSAT companies, foundries, IDM, Fabless companies, EDA tool manufacturers, etc.
2021-09-21, Infineon's 300mm thin wafer power semiconductor plant has started
s 300mm thin wafer power semiconductor plant has started According to the official announcement of Infineon Technologies AG, its 300mm thin wafer power semiconductor chip factory in Villach, Austria has officially started operations.
2021-09-21, SMT knowledge introduction, PCBA, IC, semiconductor, SMT
edge introduction, PCBA, IC, semiconductor, SMT High assembly density, small size and light weight of electronic products.
2021-08-27, Introduction to Microcontroller Unit
ion to Microcontroller Unit Microcontroller (MCU), also known as single-chip microcomputer or MCU, is to appropriately reduce the frequency and specifications of the central processing unit (CPU), reduce memory, USB, counter (timer), A/D conversion, UART, PLC, DMA, etc.
2021-08-27, Introduction of Digital Signal Processor
ion of Digital Signal Processor Digital signal processor, also known as DSP chip, is a microprocessor tool especially suitable for digital signal processing operations.
2021-08-04, Renesas launches SOTB process embedded flash memory low-power technology for energy harvesting and battery-free power supply
aunches SOTB process embedded flash memory low-power technology for energy harvesting and battery-free power supply Renesas Electronics Co.
2021-08-04, AMD will fully embrace CPU and GPU HBM?
fully embrace CPU and GPU HBM? Recently, relevant information broke that AMD's next-generation Zen 4-core EPYC Genoa processor may be equipped with HBM content to form a formation with Intel's next-generation server CPU Xeon Sapphire Rapids.
2021-08-04, Analog Devices-Dual and single µModule regulators provide high peak and thermal performance
vices-Dual or single µModule regulators provide high peak efficiency and excellent thermal performance ADI's Power by Linear LTM4662 is a dual 15A and single 30A step-down µModule regulator, using BGA packaging technology, with exposed stacked inductors to improve thermal performance.
2021-08-04, Why the global chip is out of stock
lobal chip is out of stock Expert analysis has the following reasons 1.
2021-08-04, Google's self-developed chip will be on stage, or will be handed over to Samsung's foundry
self-developed chip will be on stage, or will be handed over to Samsung's foundry Google has also joined the self-developed chip camp.
2021-07-25, Texas Instruments microcontroller platform is oriented to digital control based on TMS320F2807x
truments microcontroller platform is oriented to digital control based on TMS320F2807x The new Texas Instruments TMS320F2807x microcontroller platform is part of the Piccolo series and is particularly suitable for applications based on digital control, including inverters, telecom rectifiers, server power supplies, renewable energy, and automotive power supplies.
2021-07-25, Osram will promote wireless lighting in smart buildings
l promote wireless lighting in smart buildings Osram provides interoperability between the Casambi CBU-DCS module and the Osram DEXAL driver.
2021-07-25, 5.8G ETC license plate recognition module, effectively improving the accuracy of license plate recognition
license plate recognition module, effectively improving the accuracy of license plate recognition The ETC recognition module is a module developed based on NWF580, which meets both the GB/T20851.1-2007 communication standard and the toll road network toll ambiguous path recognition two technical requirements. The ETC recognition module uses 5.8G radio frequency technology, which can effectively quickly connect the ETC roadside unit (RSU) and the ETC on-board unit (OBU), and read the license plate number in the OBU and provide it to the parking lot gate. Control system use. The combination of 5.8G ETC module and camera vehicle license plate recognition technology can avoid bad weather conditions such as dim light, rain, fog, snow and other adverse weather conditions that affect the camera license plate recognition, and obtain OBU vehicle license plate information through radio frequency to improve equipment The purpose of the license plate recognition rate is to help system integrators effectively solve the problem of deduction caused by inaccurate recognition, realize more accurate deduction services, and improve user experience. Features Improve recognition efficiency and accuracy, Less affected by the weather environment, Low cost, simple function Small size, can be embedded on the control board; Built-in standard algorithm, flexible configuration, Can read OBU information, including license plate number, license plate color, vehicle type, user type, etc.; Performance Recognition distance: 5~6 meters Transmitting power: 20~28dBm can be set Receiving sensitivity: -90~-50dBm can be set Antenna beam: 60 degrees Transmission frequency: Channel 1: 5.83GHz Channel 2: 5.84GHz Receiving frequency: Channel 1: 5.79GHz Channel 2: 5.80GHz Reading time: 500 milliseconds, 5 license plates Electrical characteristics Input voltage: 4.5-7v IO voltage: 3.3 volts Working current: less than 200 mA Standby current: less than
