514-87-560M33-001148

Preci-Dip 514-87-560M33-001148

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  • 514-87-560M33-001148
  • Preci-Dip
  • CONN SOCKET BGA 560POS GOLD
  • Sockets for ICs, Transistors
  • 514-87-560M33-001148 Datasheet
  • -
  • -
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 778
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
514-87-560M33-001148
Category
Sockets for ICs, Transistors
Manufacturer
Preci-Dip
Description
CONN SOCKET BGA 560POS GOLD
Package
-
Series
514
Type
BGA
Features
Open Frame
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Termination
Solder
Housing Material
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating
0.100" (2.54mm)
Contact Finish - Mating
Gold
Contact Finish - Post
Tin
Contact Finish Thickness - Mating
Flash
Number of Positions or Pins (Grid)
560 (33 x 33)
Contact Material - Mating
Beryllium Copper
Pitch - Post
0.100" (2.54mm)
Contact Material - Post
Brass
Package_case
-

514-87-560M33-001148 Guarantees

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Preci-Dip
Preci-Dip
Preci-Dip - Preci-Dip packs unequaled expertise into cutting-edge interconnect components. Leveraging advanced designs, and top materials, with incomparable Swiss precision,Preci-Dip’s precision tools and contact assembly machines are developed, designed, and produced ...
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