558-10-192M16-001104

Preci-Dip 558-10-192M16-001104

The picture is for reference only, please refer to the product specification

  • 558-10-192M16-001104
  • Preci-Dip
  • BGA SURFACE MOUNT 1.27MM
  • Sockets for ICs, Transistors
  • 558-10-192M16-001104 Datasheet
  • -
  • -
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 2527
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
558-10-192M16-001104
Category
Sockets for ICs, Transistors
Manufacturer
Preci-Dip
Description
BGA SURFACE MOUNT 1.27MM
Package
-
Series
558
Type
BGA
Features
Closed Frame
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Termination
Solder
Housing Material
FR4 Epoxy Glass
Pitch - Mating
0.050" (1.27mm)
Contact Finish - Mating
Gold
Contact Finish - Post
Gold
Contact Finish Thickness - Mating
10µin (0.25µm)
Number of Positions or Pins (Grid)
192 (16 x 16)
Contact Material - Mating
Brass
Pitch - Post
0.050" (1.27mm)
Contact Finish Thickness - Post
10µin (0.25µm)
Contact Material - Post
Brass
Package_case
-

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Preci-Dip
Preci-Dip
Preci-Dip - Preci-Dip packs unequaled expertise into cutting-edge interconnect components. Leveraging advanced designs, and top materials, with incomparable Swiss precision,Preci-Dip’s precision tools and contact assembly machines are developed, designed, and produced ...
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