Samtec Inc. EJH-113-01-S-D-TH-09
- EJH-113-01-S-D-TH-09
- Samtec Inc.
- .100 X .100 EJECTOR HEADER ASSEM
- Rectangular Connectors - Headers, Male Pins
- EJH-113-01-S-D-TH-09 Datasheet
- -
- -
- Lead free / RoHS Compliant
- 2956
- Spot Inventory / Athorized Dstributor / Factory Excess Stock
- 1 year quality assurance 》
- Click to get rates
Part Number EJH-113-01-S-D-TH-09 |
Category Rectangular Connectors - Headers, Male Pins |
Manufacturer Samtec Inc. |
Description .100 X .100 EJECTOR HEADER ASSEM |
Package - |
Series EJH |
Features Keying Slot |
Operating Temperature -55°C ~ 125°C |
Mounting Type Through Hole |
Termination Solder |
Style Board to Cable/Wire |
Current Rating 3A |
Contact Material Phosphor Bronze |
Number of Positions 26 |
Connector Type Header |
Number of Positions Loaded 25 |
Number of Rows 2 |
Insulation Color Black |
Contact Type Male Pin |
Fastening Type Latch Lock/Eject Hooks |
Pitch - Mating 0.100" (2.54mm) |
Shrouding Shrouded - 4 Wall |
Contact Length - Mating 0.225" (5.72mm) |
Contact Length - Post 0.120" (3.05mm) |
Insulation Height 0.500" (12.70mm) |
Contact Shape Square |
Contact Finish - Mating Gold |
Contact Finish - Post Tin |
Insulation Material Liquid Crystal Polymer (LCP) |
Row Spacing - Mating 0.100" (2.54mm) |
Package_case - |
EJH-113-01-S-D-TH-09 Guarantees
• Prompt Responsiveness
• Guaranteed Quality
• Global Access
• Competitive Market Price
• One-Stop support services of supply chain
Jinftry, Your most trustworthy component supplier, welcome to send us the inquiry, thank you!
Do you have any questions about EJH-113-01-S-D-TH-09 ?
Feel free to contact us:
+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( Email first will be appreciative )
Customer reviews
Samtec Inc.
Founded in 1976, Samtec is a privately held global manufacturer of a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, microelectronics, flexible stacking, and micro/rugged components ...
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