Samtec Inc. FTMH-113-02-F-DV-EP-A-P
- FTMH-113-02-F-DV-EP-A-P
- Samtec Inc.
- 1MM MICRO TERMINAL STRIPS
- Rectangular Connectors - Headers, Male Pins
- FTMH-113-02-F-DV-EP-A-P Datasheet
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Lead free / RoHS Compliant
- 25066
- Spot Inventory / Athorized Dstributor / Factory Excess Stock
- 1 year quality assurance 》
- Click to get rates
Part Number FTMH-113-02-F-DV-EP-A-P |
Category Rectangular Connectors - Headers, Male Pins |
Manufacturer Samtec Inc. |
Description 1MM MICRO TERMINAL STRIPS |
Package - |
Series FTMH |
Features Board Guide, End Shrouds, Pick and Place |
Operating Temperature -55°C ~ 125°C |
Mounting Type Surface Mount |
Termination Solder |
Style Board to Board |
Current Rating 2.8A per Contact |
Contact Material Phosphor Bronze |
Number of Positions 26 |
Connector Type Header |
Number of Positions Loaded All |
Number of Rows 2 |
Insulation Color Black |
Contact Type Male Pin |
Fastening Type Push-Pull |
Material Flammability Rating UL94 V-0 |
Pitch - Mating 0.039" (1.00mm) |
Shrouding Unshrouded |
Contact Length - Mating 0.075" (1.90mm) |
Insulation Height 0.059" (1.50mm) |
Contact Shape Square |
Contact Finish - Mating Gold |
Contact Finish - Post Tin |
Insulation Material Liquid Crystal Polymer (LCP) |
Contact Finish Thickness - Mating 3µin (0.08µm) |
Row Spacing - Mating 0.039" (1.00mm) |
Package_case - |
FTMH-113-02-F-DV-EP-A-P Guarantees
• Prompt Responsiveness
• Guaranteed Quality
• Global Access
• Competitive Market Price
• One-Stop support services of supply chain
Jinftry, Your most trustworthy component supplier, welcome to send us the inquiry, thank you!
Do you have any questions about FTMH-113-02-F-DV-EP-A-P ?
Feel free to contact us:
+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
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Customer reviews
Samtec Inc.
![Samtec Inc.](https://www.jinftry.com/image/catalog/manufacturer/logos/samtec.png)
Founded in 1976, Samtec is a privately held global manufacturer of a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, microelectronics, flexible stacking, and micro/rugged components ...
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