IPL1-110-02-L-D-K

Samtec Inc. IPL1-110-02-L-D-K

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  • IPL1-110-02-L-D-K
  • Samtec Inc.
  • .100 TERMINAL ASSEMBLY
  • Rectangular Connectors - Headers, Male Pins
  • IPL1-110-02-L-D-K Datasheet
  • -
  • -
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 16308
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
IPL1-110-02-L-D-K
Category
Rectangular Connectors - Headers, Male Pins
Manufacturer
Samtec Inc.
Description
.100 TERMINAL ASSEMBLY
Package
-
Series
Mini Mate? IPL1
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Termination
Solder
Style
Board to Cable/Wire
Contact Material
Phosphor Bronze
Number of Positions
20
Voltage Rating
675VAC, 954VDC
Connector Type
Header
Number of Positions Loaded
All
Number of Rows
2
Insulation Color
Natural
Contact Type
Male Pin
Fastening Type
Locking Ramp
Material Flammability Rating
UL94 V-0
Pitch - Mating
0.100" (2.54mm)
Shrouding
Shrouded - 4 Wall
Contact Length - Mating
0.215" (5.46mm)
Insulation Height
0.320" (8.13mm)
Contact Shape
Square
Contact Finish - Mating
Gold
Contact Finish - Post
Tin
Insulation Material
Liquid Crystal Polymer (LCP)
Contact Finish Thickness - Mating
10µin (0.25µm)
Row Spacing - Mating
0.100" (2.54mm)
Package_case
-

IPL1-110-02-L-D-K Guarantees

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• Prompt Responsiveness

• Guaranteed Quality

• Global Access

• Competitive Market Price

• One-Stop support services of supply chain

Jinftry, Your most trustworthy component supplier, welcome to send us the inquiry, thank you!

Do you have any questions about IPL1-110-02-L-D-K ?
Feel free to contact us:

+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( Email first will be appreciative )

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Samtec Inc.
Samtec Inc.
Founded in 1976, Samtec is a privately held global manufacturer of a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, microelectronics, flexible stacking, and micro/rugged components ...
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