LPC1311FHN33/01,55

NXP USA Inc. LPC1311FHN33/01,55

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  • LPC1311FHN33/01,55
  • NXP USA Inc.
  • IC MCU 32BIT 8KB FLASH 32HVQFN
  • Embedded - Microcontrollers
  • LPC1311FHN33/01,55 Datasheet
  • 32-VQFN Exposed Pad
  • Tray
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 27694
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
LPC1311FHN33/01,55
Category
Embedded - Microcontrollers
Manufacturer
NXP USA Inc.
Description
IC MCU 32BIT 8KB FLASH 32HVQFN
Package
Tray
Series
LPC13xx
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
32-VQFN Exposed Pad
Supplier Device Package
32-HVQFN (7x7)
Voltage - Supply (Vcc/Vdd)
2V ~ 3.6V
Speed
72MHz
Number of I/O
28
EEPROM Size
-
Core Processor
ARM® Cortex®-M3
RAM Size
4K x 8
Core Size
32-Bit
Connectivity
I²C, Microwire, SPI, SSI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, WDT
Program Memory Size
8KB (8K x 8)
Program Memory Type
FLASH
Data Converters
A/D 8x10b
Oscillator Type
Internal
Package_case
32-VQFN Exposed Pad

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NXP USA Inc.
NXP USA Inc.
NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is ...
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