LPC18S30FET256E

NXP USA Inc. LPC18S30FET256E

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  • LPC18S30FET256E
  • NXP USA Inc.
  • IC MCU 32BIT ROMLESS 256LBGA
  • Embedded - Microcontrollers
  • LPC18S30FET256E Datasheet
  • 256-LBGA
  • Tray
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 3753
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
LPC18S30FET256E
Category
Embedded - Microcontrollers
Manufacturer
NXP USA Inc.
Description
IC MCU 32BIT ROMLESS 256LBGA
Package
Tray
Series
LPC18xx
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
256-LBGA
Supplier Device Package
256-LBGA (17x17)
Voltage - Supply (Vcc/Vdd)
2.2V ~ 3.6V
Speed
180MHz
Number of I/O
164
EEPROM Size
-
Core Processor
ARM® Cortex®-M3
RAM Size
200K x 8
Core Size
32-Bit
Connectivity
CANbus, EBI/EMI, Ethernet, I²C, IrDA, Microwire, QEI, MMC/SD, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Program Memory Size
-
Program Memory Type
ROMless
Data Converters
A/D 8x10b; D/A 1x10b
Oscillator Type
Internal
Package_case
256-LBGA

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NXP USA Inc.
NXP USA Inc.
NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is ...
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