LPC55S14JBD64E

NXP USA Inc. LPC55S14JBD64E

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  • LPC55S14JBD64E
  • NXP USA Inc.
  • IC MCU 32BIT 128KB FLASH 64HTQFP
  • Embedded - Microcontrollers
  • LPC55S14JBD64E Datasheet
  • 64-TQFP Exposed Pad
  • Tray
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 20394
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
LPC55S14JBD64E
Category
Embedded - Microcontrollers
Manufacturer
NXP USA Inc.
Description
IC MCU 32BIT 128KB FLASH 64HTQFP
Package
Tray
Series
LPC55S1x
Operating Temperature
-40°C ~ 105°C (TA)
Mounting Type
Surface Mount
Package / Case
64-TQFP Exposed Pad
Supplier Device Package
64-HTQFP (10x10)
Voltage - Supply (Vcc/Vdd)
1.8V ~ 3.6V
Speed
150MHz
Number of I/O
36
EEPROM Size
-
Core Processor
ARM® Cortex®-M33
RAM Size
80K x 8
Core Size
32-Bit
Connectivity
CANbus, Flexcomm, I²C, SPI, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, RNG, WDT
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Data Converters
A/D 10x16b SAR
Oscillator Type
Internal
Package_case
64-TQFP Exposed Pad

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NXP USA Inc.
NXP USA Inc.
NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is ...
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