MC9S12XEP100MVL

NXP USA Inc. MC9S12XEP100MVL

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  • MC9S12XEP100MVL
  • NXP USA Inc.
  • IC MCU 16BIT 1MB FLASH 208MAPBGA
  • Embedded - Microcontrollers
  • MC9S12XEP100MVL Datasheet
  • 208-BGA
  • Tray
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 14390
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
MC9S12XEP100MVL
Category
Embedded - Microcontrollers
Manufacturer
NXP USA Inc.
Description
IC MCU 16BIT 1MB FLASH 208MAPBGA
Package
Tray
Series
HCS12X
Operating Temperature
-40°C ~ 125°C (TA)
Mounting Type
Surface Mount
Package / Case
208-BGA
Supplier Device Package
208-BGA (17x17)
Voltage - Supply (Vcc/Vdd)
1.72V ~ 5.5V
Speed
50MHz
Number of I/O
152
EEPROM Size
4K x 8
Core Processor
HCS12X
RAM Size
64K x 8
Core Size
16-Bit
Connectivity
CANbus, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Program Memory Size
1MB (1M x 8)
Program Memory Type
FLASH
Data Converters
A/D 32x12b
Oscillator Type
External
Package_case
208-BGA

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NXP USA Inc.
NXP USA Inc.
NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is ...
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