MTSW-102-07-T-S-220

Samtec Inc. MTSW-102-07-T-S-220

The picture is for reference only, please refer to the product specification

  • MTSW-102-07-T-S-220
  • Samtec Inc.
  • CONN HEADER 2POS .100" TH
  • Rectangular Connectors - Headers, Male Pins
  • MTSW-102-07-T-S-220 Datasheet
  • -
  • -
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 1334
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
MTSW-102-07-T-S-220
Category
Rectangular Connectors - Headers, Male Pins
Manufacturer
Samtec Inc.
Description
CONN HEADER 2POS .100" TH
Package
-
Series
Flex Stack, MTSW
Operating Temperature
-55°C ~ 105°C
Mounting Type
Through Hole
Termination
Solder
Style
Board to Board or Cable
Current Rating
3A
Contact Material
Phosphor Bronze
Number of Positions
2
Connector Type
Header, Cuttable
Number of Positions Loaded
All
Number of Rows
1
Insulation Color
Black
Contact Type
Male Pin
Fastening Type
Push-Pull
Pitch - Mating
0.100" (2.54mm)
Shrouding
Unshrouded
Contact Length - Mating
0.220" (5.59mm)
Contact Length - Post
0.110" (2.79mm)
Insulation Height
0.100" (2.54mm)
Contact Shape
Square
Contact Finish - Mating
Tin
Contact Finish - Post
Tin
Insulation Material
Polyester, Glass Filled
Overall Contact Length
0.430" (10.92mm)
Package_case
-

MTSW-102-07-T-S-220 Guarantees

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• Prompt Responsiveness

• Guaranteed Quality

• Global Access

• Competitive Market Price

• One-Stop support services of supply chain

Jinftry, Your most trustworthy component supplier, welcome to send us the inquiry, thank you!

Do you have any questions about MTSW-102-07-T-S-220 ?
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+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( Email first will be appreciative )

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Samtec Inc.
Samtec Inc.
Founded in 1976, Samtec is a privately held global manufacturer of a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, microelectronics, flexible stacking, and micro/rugged components ...
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