NXP USA Inc. SPC5517EAMMG66
- SPC5517EAMMG66
- NXP USA Inc.
- IC MCU 32B 1.5MB FLASH 208MAPBGA
- Embedded - Microcontrollers
- SPC5517EAMMG66 Datasheet
- 208-BGA
- Tray
-
Lead free / RoHS Compliant
- 11379
- Spot Inventory / Athorized Dstributor / Factory Excess Stock
- 1 year quality assurance 》
- Click to get rates
Part Number SPC5517EAMMG66 |
Category Embedded - Microcontrollers |
Manufacturer NXP USA Inc. |
Description IC MCU 32B 1.5MB FLASH 208MAPBGA |
Package Tray |
Series MPC55xx Qorivva |
Operating Temperature -40°C ~ 125°C (TA) |
Mounting Type Surface Mount |
Package / Case 208-BGA |
Supplier Device Package 208-BGA (17x17) |
Voltage - Supply (Vcc/Vdd) 4.5V ~ 5.25V |
Speed 66MHz |
Number of I/O 144 |
EEPROM Size - |
Core Processor e200z0, e200z1 |
RAM Size 80K x 8 |
Core Size 32-Bit Dual-Core |
Connectivity CANbus, EBI/EMI, I²C, SCI, SPI |
Peripherals DMA, POR, PWM, WDT |
Program Memory Size 1.5MB (1.5M x 8) |
Program Memory Type FLASH |
Data Converters A/D 40x12b |
Oscillator Type Internal |
Package_case 208-BGA |
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