SPC5517EAMMG66

NXP USA Inc. SPC5517EAMMG66

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  • SPC5517EAMMG66
  • NXP USA Inc.
  • IC MCU 32B 1.5MB FLASH 208MAPBGA
  • Embedded - Microcontrollers
  • SPC5517EAMMG66 Datasheet
  • 208-BGA
  • Tray
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 11379
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
SPC5517EAMMG66
Category
Embedded - Microcontrollers
Manufacturer
NXP USA Inc.
Description
IC MCU 32B 1.5MB FLASH 208MAPBGA
Package
Tray
Series
MPC55xx Qorivva
Operating Temperature
-40°C ~ 125°C (TA)
Mounting Type
Surface Mount
Package / Case
208-BGA
Supplier Device Package
208-BGA (17x17)
Voltage - Supply (Vcc/Vdd)
4.5V ~ 5.25V
Speed
66MHz
Number of I/O
144
EEPROM Size
-
Core Processor
e200z0, e200z1
RAM Size
80K x 8
Core Size
32-Bit Dual-Core
Connectivity
CANbus, EBI/EMI, I²C, SCI, SPI
Peripherals
DMA, POR, PWM, WDT
Program Memory Size
1.5MB (1.5M x 8)
Program Memory Type
FLASH
Data Converters
A/D 40x12b
Oscillator Type
Internal
Package_case
208-BGA

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NXP USA Inc.
NXP USA Inc.
NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is ...
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