TMM-105-01-T-S-RE

Samtec Inc. TMM-105-01-T-S-RE

The picture is for reference only, please refer to the product specification

  • TMM-105-01-T-S-RE
  • Samtec Inc.
  • CONN HEADER 5POS 2MM T/H R/A
  • Rectangular Connectors - Headers, Male Pins
  • TMM-105-01-T-S-RE Datasheet
  • -
  • -
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 1051
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
TMM-105-01-T-S-RE
Category
Rectangular Connectors - Headers, Male Pins
Manufacturer
Samtec Inc.
Description
CONN HEADER 5POS 2MM T/H R/A
Package
-
Series
FleXYZ? TMM
Operating Temperature
-55°C ~ 105°C
Mounting Type
Through Hole, Right Angle
Termination
Solder
Style
Board to Board or Cable
Current Rating
3.2A per Contact
Contact Material
Phosphor Bronze
Number of Positions
5
Connector Type
Header
Number of Positions Loaded
All
Number of Rows
1
Insulation Color
Black
Contact Type
Male Pin
Fastening Type
Push-Pull
Pitch - Mating
0.079" (2.00mm)
Shrouding
Unshrouded
Contact Length - Mating
0.126" (3.20mm)
Contact Length - Post
0.120" (3.05mm)
Insulation Height
0.079" (2.00mm)
Contact Shape
Square
Contact Finish - Mating
Tin
Contact Finish - Post
Tin
Insulation Material
Liquid Crystal Polymer (LCP)
Package_case
-

TMM-105-01-T-S-RE Guarantees

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• Prompt Responsiveness

• Guaranteed Quality

• Global Access

• Competitive Market Price

• One-Stop support services of supply chain

Jinftry, Your most trustworthy component supplier, welcome to send us the inquiry, thank you!

Do you have any questions about TMM-105-01-T-S-RE ?
Feel free to contact us:

+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( Email first will be appreciative )

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Samtec Inc.
Samtec Inc.
Founded in 1976, Samtec is a privately held global manufacturer of a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, microelectronics, flexible stacking, and micro/rugged components ...
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