Samtec Inc. TSW-108-23-T-S
- TSW-108-23-T-S
- Samtec Inc.
- CONN HEADER 8POS .100" SNGL TIN
- Rectangular Connectors - Headers, Male Pins
- TSW-108-23-T-S Datasheet
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Lead free / RoHS Compliant
- 20794
- Spot Inventory / Athorized Dstributor / Factory Excess Stock
- 1 year quality assurance 》
- Click to get rates
Part Number TSW-108-23-T-S |
Category Rectangular Connectors - Headers, Male Pins |
Manufacturer Samtec Inc. |
Description CONN HEADER 8POS .100" SNGL TIN |
Package - |
Series TSW |
Operating Temperature -55°C ~ 105°C |
Mounting Type Through Hole |
Termination Solder |
Style Board to Board or Cable |
Contact Material Phosphor Bronze |
Number of Positions 8 |
Connector Type Header |
Number of Positions Loaded All |
Number of Rows 1 |
Insulation Color Black |
Contact Type Male Pin |
Fastening Type Push-Pull |
Material Flammability Rating UL94 V-0 |
Pitch - Mating 0.100" (2.54mm) |
Shrouding Unshrouded |
Contact Length - Mating 0.230" (5.84mm) |
Contact Length - Post 0.115" (2.92mm) |
Insulation Height 0.100" (2.54mm) |
Contact Shape Square |
Contact Finish - Mating Tin |
Contact Finish - Post Tin |
Insulation Material Polybutylene Terephthalate (PBT) |
Overall Contact Length 0.445" (11.30mm) |
Package_case - |
TSW-108-23-T-S Guarantees
• Prompt Responsiveness
• Guaranteed Quality
• Global Access
• Competitive Market Price
• One-Stop support services of supply chain
Jinftry, Your most trustworthy component supplier, welcome to send us the inquiry, thank you!
Do you have any questions about TSW-108-23-T-S ?
Feel free to contact us:
+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( Email first will be appreciative )
Customer reviews
Samtec Inc.
![Samtec Inc.](https://www.jinftry.com/image/catalog/manufacturer/logos/samtec.png)
Founded in 1976, Samtec is a privately held global manufacturer of a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, microelectronics, flexible stacking, and micro/rugged components ...
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