The world's first multi-chip package product based on LPDDR5 DRAM High-performance memory and storage are integrated in a single fast package to accelerate 5G applications

Post Date:2021-07-13,Micro Commercial Co

Shanghai, China - Micron Technology Inc., a leading supplier of memory and storage solutions, today announced the industry's first universal flash storage (UFS) multi-chip package product uMCP5 based on low-power DDR5 (LPDDR5) DRAM.
 uMCP5 integrates high-performance, high-density, and low-power memory and storage in a compact package, enabling smartphones to cope with data-intensive 5G workloads, significantly improving speed and efficiency. This multi-chip packaged product is equipped with Micron LPDDR5 memory, high-reliability NAND, and a leading UFS3.1 controller, which implements advanced features previously only available on expensive flagship phones that use independent memory and storage chips. The emergence of uMCP5 enables such things as image recognition, advanced artificial intelligence (AI), multi-camera support,
The latest technologies such as augmented reality (AR) and high-resolution displays can be popularized on mid-to-high-end mobile phones.

Micron’s Mobile Products Division stated: “To transform the potential of 5G from the publicity level into reality, smartphones are required to be able to cope with the massive amounts of data transmitted through the network and next-generation applications. Our uMCP5 combines the fastest memory in a single package. And storage, bringing more possibilities for disruptive 5G technology.
Micron uMCP5 brings outstanding speed and efficiency to the 5G ecosystem

This release is a continuation of Micron’s announcement of uMCP5 sampling in March this year, setting a new standard for the mobile market and becoming the first multi-chip package product using the latest generation of UFS NAND storage and low-power DRAM. Today's smart phones need to store and process massive amounts of data, and the consequences are reduced video resolution, delays that affect the experience, and limited functions.

With LPDDR5, Micron has greatly increased the memory bandwidth from 3,733 Mb/sec to 6,400 Mb/sec, providing mobile users with a seamless and instant experience even when processing large amounts of data.

Qualcomm said: “5G provides smartphones with unprecedented speed and cloud connectivity. We are very pleased to see the launch of uMCP5, which will bring 5G-speed memory to the new generation of mobile phones, and ensure a first-class gaming experience and difference. Optimized camera, AI function, and faster file transfer."

uMCP5 is specifically designed for next-generation 5G devices, which can easily and quickly process and store large amounts of data without compromising performance and power consumption. High-performance memory and storage enable uMCP5 to fully support 5G download speeds and run more applications at the same time.

The main features of Micron uMCP5 include:

Significantly extended battery life: Based on the success of uMCP4, Micron used LPDDR5 memory for uMCP5 to fully utilize the 5G network; compared with LPDDR4, power consumption has been reduced by nearly 20%. In addition, Micron’s UFS 3.1 consumes 40% less power than its predecessor, UFS 2.1. For smartphone users, even when using power-consuming multimedia applications or data-intensive functions (such as AI, AR, image recognition, games, immersive entertainment, etc.), they can have a longer battery life.
Fast download speed: Compared with Micron's previous solution based on UFS 2.1, Micron uMCP5 unleashes the full potential of 5G performance, and the continuous download speed can be accelerated by 20%.
Durability improvement: The durability of Micron uMCP5 NAND is increased by about 66%, and it can allow 5,000 erasing and writing, which doubles the number of erasing and writing of the device and the amount of data without degrading the performance of the device. Even for heavy mobile phone users, it can effectively extend the service life of smart phones.
Industry-leading bandwidth: Devices using uMCP5 will support up to 6,400 Mb/s DRAM bandwidth, which is a 50% increase compared to the 4,266 Mb/s bandwidth of the previous generation LPDDR4x. This allows mobile users to run multiple applications at the same time without compromising the experience.
The increased bandwidth also enables AI computational photography in smartphones to obtain higher-quality image processing, bringing users professional photography capabilities. Micron is the industry's first supplier to support full-speed LPDDR5.
Latest flash memory performance: Micron uMCP5 also uses the fastest UFS 3.1 storage interface. Compared with its previous generation UFS 2.1 products, sequential read performance has doubled and write speed has been increased by 20%.
  Micron used its multi-chip packaging expertise and mastered manufacturing and packaging technology to design the uMCP5 in the most compact size, enabling a slimmer and more flexible smartphone design. Compared with the standalone version of LPDDR5 and UFS solutions, the Micron uMCP5 multi-chip package can save 55% of printed circuit board space. The space saved allows mobile phone manufacturers to maximize battery capacity or add other features, such as cameras, gesture elements, or sensors. Micron can provide multiple capacity configuration options up to 12 GB LPDDR5 and 512 GB NAND.

Availability of Micron uMCP5

uMCP5 is now available for mass production, with four different density configurations: 128+8 GB, 128+12 GB, 256+8 GB and 256+12 GB. For more information, please visit

Global brands Micron® and Crucial®, Micron’s rich high-performance memory and storage technology portfolio-including DRAM, NAND, 3D XPoint™ and NOR, enrich the world by changing the way the world uses information Human life. Micron's memory and storage solutions have helped important markets such as mobile, data center, client, consumer, industrial, graphics, automotive, and network realize disruptive development trends, including artificial intelligence, 5G, machine learning, and autonomous driving.

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